APAC Innovation Summit 2015 Series - Robotics
Connect • Collaborate • Catalyse
With an aim to connect all stakeholders, facilitate collaboration and catalyse new ideas and opportunities, APAC Innovation Summit, the flagship event of Hong Kong Science and Technology Parks Corporation, adopts a thematic approach covering 5 major technology areas with a series of events spreading over Year 2015-2016. The upcoming “Robotics” series in June will gather a panel of world-renowned experts to share on the robotics technology trend and its applications in homecare, edutainment, industrial automation and medical field. The 2-day event will also feature a mini-exhibition to showcase the latest innovations from academia, research community and industry.
Date: | 24 - 25 June 2015 |
Time: | 09:30 – 17:30 |
Venue: | Grand Hall, Hong Kong Science Park |
Organiser: | Hong Kong Science and Technology Parks Corporation |
Website: | http://www.apacinnosummit.net |
Enquiry: | +852-26296840/ info@apacinnosummit.net |
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